Silicone Gel

Cures into ultra-soft gel (Shore A 7~15), effectively buffer thermal expansion stress & mechanical vibration, prevent cracking of fragile chips & MEMS sensors. Fully transparent formula allows visual inspection of internal circuits for easy maintenance & defect checking.

Low mixed viscosity 550~750 cps with perfect self-leveling flow, fully penetrate tiny gaps as thin as 0.1mm without air voids. Ideal for mass potting of miniaturized micro-electronics, compatible with vacuum deaerator equipment.

Addition cure chemistry releases no volatile alcohol byproducts during curing, zero corrosion to PCB traces, solder pads, inductors & optical chips. Safe for high-precision optoelectronic & automotive semiconductor modules.

Stable performance from -50℃ to 200℃, no hardening/cracking under thermal cycling. Dielectric strength ≥13kV/mm delivers superior insulation, waterproof & dustproof performance for outdoor solar, communication & automotive electronics.

Dual curing options for flexible production lines:

1. Room temp curing: Fully cured within 6h @25℃, no heating oven required;

2. Heat accelerated curing: 30 mins @80℃ / 10 mins @100℃, drastically boost automated production throughput.