Potting Compound

Model 8266 is two-component solvent-free polyurethane electronic potting compound, composed of polyether polyol and isocyanate system. It features low viscosity and self-leveling performance after mixing, cures into flexible elastomer at room temperature or under heating condition. Non-corrosive formula protects PCB pads and precision components perfectly. It overcomes the defects of brittle epoxy resin and weak adhesion of silicone rubber, providing long-term insulation, waterproof and shock absorption protection for automotive and industrial electronic modules.

Key Advantages：Low Viscosity & Self-Leveling: Mixed viscosity 900~1000 cps, automatically fill tiny gaps, easy vacuum defoaming, compatible with automatic dispensing & manual potting.
Flexible & Low Stress: Shore A87 soft elastomer absorbs vibration and thermal shock stress, preventing PCB cracking and component desoldering.
Wide Adhesion Range: Great bonding strength on aluminum, copper, zinc alloy, ABS, PC and PCB boards, no delamination after long service.
Wide Temperature Stability: Continuous service temperature -40℃ ~ 120℃, resistant to moisture, salt spray and weak electrolyte corrosion for outdoor equipment.
Excellent Electrical Insulation: High dielectric strength & volume resistivity, effectively prevent short circuit for high/low voltage control modules.
Eco-Friendly for Export: Heavy metal free & zero volatile solvent, fully RoHS & REACH compliant, meets global new energy export standards.

Typical Applications：New Energy Automotive Electronics: TPMS sensor, vehicle antenna, BMS auxiliary control board, small charging pile controller.
Industrial Control Equipment: Switch power supply, drive PCB, current transformer, low voltage signal controller, miniature transformer.
Lighting & Home Appliance: Waterproof LED driver, water/electric meter main board, smart home control module.
Communication Industrial Equipment: Outdoor signal base station, wiring harness controller, industrial sensor module encapsulation.

Standard Processing Instruction：Mix Ratio: Weigh Part A & B strictly at 5:1 by weight, stir fully for 3~5 mins until uniform color.
Defoaming: Put mixed glue into vacuum chamber for 2~5 mins to remove air bubbles.
Potting: Pour glue slowly into housing, self-level to cover all gaps of components.
Curing Schedule: Fully cured in 24~72h at room temperature; Fast cure within 4~8h under 60~80℃ heating.

Storage & Precautions：Store Part A and B separately with tight seal, prevent moisture contact to avoid premature reaction.
Finish potting within working time after mixing; leftover mixed glue cannot be stored repeatedly.
Recommended construction humidity: 40%~70%, high humidity will shorten working life.
Wear gloves during operation to avoid direct skin contact, rinse skin with clean water immediately if touched.