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SMT Adhesives 6601
Taile
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Taile 6601 SMT Adhesives Red Glue is a single-component, low-halogen epoxy resin adhesive. It is very suitable for medium to high-speed dispensing. It allows low-temperature curing, and even at high-speed and ultra-high-speed micro dot dispensing, it maintains no stringing, no overflowing, and no slumping. The stable dot shape is easy to control and preserve. It has good storage stability, excellent heat shock resistance, and excellent electrical properties. It is safe to use, solvent-free, odorless, and fully complies with environmental protection requirements.
Single-component epoxy resin system, low halogen
Suitable for medium to high-speed dispensing
Allows low-temperature curing
Maintains no stringing, no overflowing, and no slumping even at high-speed and ultra-high-speed micro dot dispensing
Stable dot shape, very easy to control
Good storage stability
Excellent heat shock resistance and excellent electrical properties
Safe to use, solvent-free, odorless
Fully complies with environmental protection requirements
Stable adhesive strength for various surface mount components
Shelf life 6 months, store in refrigerator at 2~10℃
Attribute | Content |
|---|---|
Product Name / 产品名称 | 6601 SMT Adhesives Red Glue |
Model Number / 型号 | 6601 (SMT Adhesives 6601) |
Type | Single Component Epoxy Resin Adhesive |
Composition | Epoxy resin |
Appearance | Red paste |
Specific Gravity | 1.20 |
Viscosity (25℃, 5rpm) | 310 Pa·s |
Thixotropy Index (1rpm/10rpm) | 6.7 |
Adhesive Strength | 2125C: 47N (4.8kgf); Mini-mold Tr: 51N (5.2kgf); SOP·IC 16P: 96N (9.8kgf) |
Volume Resistance | 3.8×10^16 Ω·cm (JIS K6911) |
Insulation Resistance (Initial) | 1.8×10^14 Ω (JIS Z3197) |
Insulation Resistance (After treating) | 1.6×10^12 Ω |
Dielectric Constant | 3.12 / 1MHZ (JIS K6911) |
Dielectric Loss Tangent | 0.012 / 1MHZ (JIS K6911) |
Preservation Condition | 2℃~10℃ refrigerator |
Curing Condition | PCB surface 150℃ for 90~120s (max. 165℃) or 120℃ for 120~180s, heating rate <1.5℃/s |
Packaging | Cylinder 360g/200g, Syringe 30cc/20cc/10cc |
Shelf Life | 6 months |
Place of Origin | Guangdong, China |
Brand Name | Taile / OEM |
PCB SMT mounting
Chip bonding
SMD component fixing
Electronic component bonding
High-speed micro dot dispensing
SMT reflow pre-fixing
Precision sensor industry
Electronics / Electrical industry
To maximize the performance of the adhesive, it must be stored in a refrigerator at 2℃~10℃.
Before use, take it out of the refrigerator about 4 hours in advance and let it return to room temperature (25℃±3℃).
Toluene or ethyl acetate can be used for cleaning the red glue.
If the PCB has been dispensed (dispensing or stencil printing), it must be mounted and reflowed within 4 hours.
When operation is interrupted or the process is changed, the unused adhesive can be used within one week at 25℃±3℃.
If the adhesive has been thawed but will not be used for a long time, it should be put back into the refrigerator.
PCBs assembled with SMT red glue and reflow soldering should preferably be soldered in a tin furnace within 7 days.
Basic Properties：
Item | Value |
|---|---|
Composition | Epoxy resin |
Appearance | Red paste |
Specific Gravity | 1.20 |
Viscosity（25℃, 5rpm） | 310 Pa·s |
Thixotropy Index（1rpm/10rpm） | 6.7 |
Adhesive Strength 2125C | 47N (4.8kgf) |
Adhesive Strength Mini-mold Tr | 51N (5.2kgf) |
Adhesive Strength SOP·IC 16P | 96N (9.8kgf) |
Volume Resistance | 3.8×10^16 Ω·cm (JIS K6911) |
Insulation Resistance (Initial) | 1.8×10^14 Ω (JIS Z3197) |
Insulation Resistance (After treating) | 1.6×10^12 Ω |
Dielectric Constant | 3.12 / 1MHZ (JIS K6911) |
Dielectric Loss Tangent | 0.012 / 1MHZ (JIS K6911) |
Preservation Condition | Store in refrigerator at 2℃~10℃ |
Physical & Chemical Properties (Curing: 150℃ for 3 minutes)：
Item | Value |
|---|---|
Specific Gravity | 1.20 |
Viscosity（25℃·5 rpm） | 310 Pa·s |
Thixotropy Index（1rpm/10rpm） | 6.7 |
Water Absorption | 0.18% |
Glass Transition Temperature | 142℃ |
Linear Expansion Coefficient (below Tg) | 3.5×10^-5 |
Linear Expansion Coefficient (above Tg) | 12.8×10^-5 |
Thermal Expansion Coefficient（ASTM D3386） | 60×10^-6/℃ |
Volume Resistance（JIS K6911） | 3.8×10^-16 Ω·cm |
Thermal Strength（ASMT-D-1002） | >8 MPa / >900 Psi |
Shrinkage | 0.8% |
Thermal Conductivity | 0.5 W/m℃ |
Hardness（Shore D） | 89 |
Tensile Strength（ASTM D882） | 75 N/mm² |
Cured Strength Test (150℃ for 90s, horizontal push)：
Component Type/Size | Applying Amount（mg） | Adhesive Strength（kgf） |
|---|---|---|
2125C | 0.20 | 4.8 |
2125R | 0.20 | 4.9 |
3216C | 0.25 | 5.6 |
3216R | 0.25 | 5.8 |
Glass Diode 3.5×1.4 | 0.40 | 3.5 |
Mini-mold Tr 3216 A | 0.40 | 5.2 |
Mini-mold Tr 3216 B | 0.40 | 5.5 |
SOP IC 12pin | 1.60 | 3.2 |
Environmental Resistance (aged at standard temperature, tested at 22℃)：
Condition | 100hr | 500hr | 1000hr |
|---|---|---|---|
Air 22℃ | 100 | 100 | 100 |
Air 150℃ | 96 | 96 | 92 |
98%RH: 40℃ | 92 | 88 | 85 |
（ Same as Section 8, retained as requested）
To maximize the performance of the adhesive, it must be stored in a refrigerator at 2℃~10℃.
Before use, take it out of the refrigerator about 4 hours in advance and let it return to room temperature (25℃±3℃).
Toluene or ethyl acetate can be used for cleaning the red glue.
If the PCB has been dispensed (dispensing or stencil printing), it must be mounted and reflowed within 4 hours.
When operation is interrupted or the process is changed, the unused adhesive can be used within one week at 25℃±3℃.
If the adhesive has been thawed but will not be used for a long time, it should be put back into the refrigerator.
PCBs assembled with SMT red glue and reflow soldering should preferably be soldered in a tin furnace within 7 days.
Packaging：
Package Style | Contents | Pack. Unit | Applicable Dispenser Makers |
|---|---|---|---|
Cylinder | 360g | 5 Pcs | For our filling machines only |
Cylinder | 200g | 5 Pcs | For our filling machines only |
Syringe A type | 30cc | 7 Pcs | KYUSHU MATSUSHITA, SANYO, TDK, CITIZEN, TOSHIBA, SONY, CKD, NITTO KOGYO, YAMAHA |
Syringe B type | 30cc | 12 Pcs | FUJI |
Syringe C type | 30cc | 12 Pcs | Panasert (Long: Mo) |
Syringe D type | 20cc | 12 Pcs | Panasert (Short: MK, MV) |
Syringe E type | 10cc | 12 Pcs | TENRYU, CASIO, JUKI, OKANO |
Storage & Transportation：
Warranty: 6 months
SMT red glue must be stored in a refrigerator at 2~10℃ and used within the shelf life (6 months from the manufacturer's production date)
When taking out the red glue, thaw it at room temperature for 4 hours in advance. Do not leave it at room temperature for more than 10 days, otherwise it must be scrapped
When operation is interrupted or the process is changed, the unused adhesive can be used within one week at 25℃±3℃
If the PCB has been dispensed (dispensing or stencil printing), it must be mounted and reflowed within 4 hours
If the adhesive has been thawed but will not be used for a long time, it should be put back into the refrigerator
Check and record the refrigerator temperature regularly
PCBs assembled with SMT red glue and reflow soldering should preferably be soldered in a tin furnace within 7 days
