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English
Two-component solvent-free epoxy adhesive is composed of resin part A and hardener part B. After mixing in fixed ratio, it cures at room temperature or moderate heating to form a rigid, high-strength solid layer with excellent insulation, waterproof, anti-corrosion and bonding performance. This series covers general bonding epoxy, electronic potting epoxy, structural casting epoxy, high-temperature resistant epoxy and transparent epoxy variants. It features low shrinkage, strong adhesion to most substrates, stable electrical insulation and chemical resistance. All formulas comply with RoHS & REACH, no corrosion to PCB, metal and plastic, widely adopted in electronics, new energy, automotive, industrial assembly and construction industries.
1. Ultra-High Structural Bonding Strength High tensile & shear strength after full cure, firmly bond metal, FR4 PCB, ceramic, ABS/PC plastic, aluminum alloy, glass; no delamination under long-term mechanical load.
2. Excellent Electrical Insulation Performance Ultra-high volume resistivity and breakdown voltage, effectively prevent electric leakage and short circuit, ideal for power modules, transformers and control board encapsulation.
3. Full Barrier Environmental Protection Dense cured layer blocks moisture, salt spray, dust, acid & alkali corrosive gas, achieves IP67/IP68 waterproof grade, extends service life in coastal & humid outdoor environments.
4. Wide Temperature Cycle Resistance Stable performance from -40℃ to 120℃; no cracking, peeling or yellowing after thousands of cold-heat cycling tests.
5. Low Shrinkage & Low Stress Curing Curing shrinkage less than 0.8%, no stress damage to precision chips and thin components; transparent formula available for visual inspection of internal circuits.
6. Customizable Process & Hardness Options Adjustable viscosity for automatic dispensing, manual pouring or brushing; rigid semi-rigid formulas optional, matching mass production & small batch maintenance processes.
Aluminum, copper, stainless steel, FR4 circuit board, aluminum substrate, ABS, PC, PA66 plastic, glass, ceramic, lithium battery housing, metal radiator, concrete.
1. Electronics Industry: PCB potting, transformer encapsulation, power supply module sealing, sensor waterproof filling
2. New Energy Industry: Lithium battery module bonding & potting, solar inverter encapsulation, wind power controller protection
3. Automotive Electronics: New energy vehicle BMS potting, auto ECU control board sealing, wiring harness fixed bonding
4. Industrial Equipment: Servo driver encapsulation, PLC module filling, mechanical structural parts bonding
5. Construction & Hardware: Metal frame fixing, stone bonding, pipeline anti-corrosion coating
6. Consumer Electronics: Smart home drive board sealing, charging module encapsulation
1. Clean the bonding/potting housing thoroughly, remove oil, dust and water vapor, fully dry the substrate surface.
2. Weigh component A and B strictly according to specified mixing ratio (standard 2:1 / 3:1 / 10:1), stir evenly until no color streaks remain.
3. Vacuum defoam the mixed glue for 3–8 minutes to eliminate tiny air bubbles.
4. Pour or dispense the mixture into the housing, finish construction before the defined pot life expires.
5. Cure at room temperature for 24h, or heat at 60–80℃ for 2–4h to accelerate curing; perform electrical & bonding tests after complete curing.
· Standard Package: 1kg/5kg/20kg A+B barrel set, dual-cartridge syringe for small batch dispensing
· Storage Condition: Sealed storage in cool dry warehouse at 10–25℃, far from open flame and direct sunlight
· Unopened Shelf Life: 12 months; seal tightly immediately after opening to avoid moisture absorption.
Test Item | General Bonding Epoxy | Electronic Potting Epoxy | High-Temp Resistant Epoxy | Transparent Casting Epoxy | Remarks |
Mix Ratio (A:B) | 2:1 / 3:1 | 2:1 | 10:1 | 3:1 | Custom ratio acceptable |
Appearance | Black / Ivory liquid | Black opaque liquid | Light yellow liquid | Colorless transparent liquid | No particle precipitation |
Viscosity (25℃) | 8,000–30,000 mPa·s | 5,000–15,000 mPa·s | 12,000–40,000 mPa·s | 6,000–20,000 mPa·s | Low viscosity for deep filling |
Pot Life (25℃) | 30–90 mins | 40–120 mins | 20–60 mins | 45–100 mins | Adjusted by formula |
Full Cure Time | 24h@25℃ / 3h@60℃ | 24h@25℃ / 2.5h@60℃ | 24h@25℃ / 4h@80℃ | 24h@25℃ / 3h@60℃ | Heating boosts efficiency |
Hardness After Cure | Shore D 75–85 | Shore D 70–82 | Shore D 80–90 | Shore D 72–83 | Rigid solid after curing |
Volume Resistivity | ≥10¹³ Ω·cm | ≥10¹⁴ Ω·cm | ≥10¹³ Ω·cm | ≥10¹⁴ Ω·cm | Superior insulation |
Breakdown Voltage | ≥18 kV/mm | ≥22 kV/mm | ≥16 kV/mm | ≥20 kV/mm | Safe for high-voltage modules |
Continuous Temp Range | -40℃ ~ 110℃ | -40℃ ~ 120℃ | -40℃ ~ 150℃ | -40℃ ~ 115℃ | High-temp type for harsh heat environment |
Curing Shrinkage | ＜0.8% | ＜0.6% | ＜0.7% | ＜0.5% | Low stress for precision parts |
Waterproof Grade | IP67 | IP68 | IP67 | IP68 | Potting type reaches highest waterproof level |
Chemical Resistance | Resist weak acid, alkali, oil | Resist acid, alkali, salt mist | Resist high-temperature oil & solvent | Resist weak corrosive liquid | Long service life outdoors |
Environmental Standard | RoHS, REACH Compliant | RoHS, REACH Compliant | RoHS, REACH Compliant | RoHS, REACH Compliant | Meet global export standards |
Shelf Life | 12 months sealed at 10–25℃ | 12 months sealed at 10–25℃ | 12 months sealed at 10–25℃ | 12 months sealed at 10–25℃ | Avoid humid storage |
