Conductive Adhesive

Product Overview

Conductive Adhesive is a high-performance functional adhesive filled with high-purity conductive particles (silver or carbon). It is designed for electrical connection, circuit repair, electromagnetic shielding and grounding bonding in electronic industries. This adhesive can cure at room temperature or low temperature, forming a stable conductive network with excellent conductivity, strong adhesion and good flexibility. It replaces traditional soldering in precision, ultra-thin and temperature-sensitive electronic components. Widely used for FPC flexible circuits, PCB repair, electronic shielding, sensor bonding and precision electronic assembly. All formulations comply with RoHS and REACH environmental standards.

Core Advantages

• Stable High Conductivity: Form uniform conductive network after curing, low resistance and stable electrical performance, not easy to drift.

• Low Temperature Curing: Room temperature curing or low-temperature baking, no damage to temperature-sensitive electronic parts, safer than soldering.

• Excellent Bonding Strength: Strong adhesion to PCB, FPC, copper foil, plastic and metal, no falling off after long-term vibration.

• Good Flexibility & Fatigue Resistance: Cured glue layer is flexible, resistant to bending and stretching, suitable for flexible circuit applications.

• Electromagnetic Shielding & Grounding Effect: Effectively eliminate static electricity, improve equipment anti-interference ability.

• No Solder Pollution: No tin residue, no short circuit risk, suitable for ultra-fine circuit gap connection.

Applicable Substrates

PCB circuit board, FPC flexible circuit, copper foil, aluminum alloy, nickel-plated surface, ABS, PC plastic, ceramic, electronic shielding sheet and precision electronic components.

Main Applications

• FPC flexible circuit bonding and circuit conduction repair

• PCB board broken circuit repair and precision circuit connection

• Electronic equipment electromagnetic shielding and grounding fixation

• Sensor, micro-component conductive assembly

• Smart wearable device, precision electronic conduction bonding

• Anti-static bonding and conductive connection of industrial electronic modules

Usage Instructions

• Clean the surface to remove oil, dust and oxide layer to ensure good contact.

• Stir the conductive adhesive evenly before use to avoid particle precipitation.

• Apply thin and uniform coating on the bonding position.

• Cure at room temperature or low temperature according to requirements.

• Test conductivity after fully cured to ensure stable electrical performance.

Package & Storage

Package: 10ml / 20ml syringe, 100g / 500g bottle
Shelf Life: 6 months (sealed at 2–8℃ refrigeration)
Storage: Sealed refrigerated storage, avoid high temperature and long-term exposure to air to prevent particle oxidation and performance attenuation.