Two‑part Conductive Adhesive

TAILE 6615 is a two-component silver-filled modified epoxy conductive adhesive. Base and curing agent are matched at 1:1 weight ratio, packaged in 50ml dual cartridge for easy manual gun dispensing. 
After complete curing, the adhesive layer possesses excellent electrical conductivity, thermal conductivity and EMI electromagnetic shielding capability, with high bonding strength to metal, PCB, ceramic and some plastics. 
It supports two curing methods: room temperature curing and heating accelerated curing, flexible for different production line demands. Fully cured material meets RoHS 2.0 environmental requirements, widely adopted in industrial electronic assembly.

Key Features
1.Three core functions: Electric conduction, heat conduction, EMI shielding 
2. Mix Ratio: Base : Curing Agent = 1:1 by weight 
3. Long pot life: 2 hours working time at 25℃ 
4. Dual curing system: 25℃/24h ambient cure; 60℃ accelerated cure 
5. Wide service temperature: -50℃ ~ 180℃ 
6.High adhesion on aluminum, copper, nickel, stainless steel, FR4 PCB, ceramics 
7. Low volume resistivity, stable conductive performance 
8. Good chemical resistance, low outgassing 
9. RoHS 2.0 compliant, suitable for export electronic products 
10.50ml dual cartridge packaging, convenient for small batch production & lab trial

Application Fields & Detailed Application Scenarios

4.1 Communication Electronic Industry
5G/4G communication modules conductive bonding;
RF radio frequency component grounding and shielding assembly;
Base station filter, resonator conductive connection;
Antenna assembly, metal antenna and PCB conductive fixation;
Communication housing seam EMI shielding joint;
Optical module, transceiver internal conductive interconnection.
4.2 PCB & Circuit Industry
PCB circuit repair, broken trace conductive repair;
FR4 circuit board bonding with metal shielding cover;
Flexible circuit FPC grounding fixation;
Circuit board shielding can bonding & electrical connection;
Printed circuit board dissimilar metal conductive assembly.
4.3 Semiconductor & Sensing Devices
Chip carrier, ceramic substrate conductive bonding;
Temperature sensor, pressure sensor internal conductive assembly;
Hall sensor, optical sensor metal shell grounding;
Microelectronic component lead conductive fixation;
MEMS device packaging conductive interconnection.4.4 Automotive Electronics
New energy vehicle BMS battery management module grounding;
Automobile radar, ADAS sensor conductive bonding;
On-board camera, vehicle display shielding assembly;
Automotive ECU control unit shielding cover bonding;
Charging pile electronic module conductive connection;
Motor controller internal grounding and shielding treatment.
4.5 Electronic Shielding & EMI Solution
Electronic equipment metal housing seam shielding bonding;
Shielding box, shielding cavity internal conductive assembly;
Electromagnetic interference repair for precision instruments;
Replace conductive gaskets for partial low-pressure shielding structure;
Medical precision equipment anti-interference conductive bonding.
4.6 Precision Instrument & Medical Electronics
Testing measuring instrument internal grounding connection;
Medical diagnostic equipment electronic module shielding;
Laboratory analytical instrument micro component conductive bonding;
Precision optical equipment circuit grounding assembly.
4.7 Energy & Power Electronics
Solar junction box internal conductive assembly;
Power supply, inverter module grounding connection;
Energy storage control unit shielding and conductive bonding.
4.8 Maintenance & Aftermarket Repair
Electronic equipment circuit conductive crack repair;
Old shielding structure renovation and supplementary bonding;
Sensor and electronic module on-site maintenance conductive adhesive.
Suitable Bonding Substrates: Copper, aluminum, nickel, silver plated metal, stainless steel, FR4 PCB, alumina ceramic,  high temperature plastic.