UV Curable Tack-reducing Acrylic Adhesive

3808-2 is a one-component solvent-based UV curable tack-reducing acrylic adhesive. Core functions: it exhibits stable pressure-sensitive adhesion before UV irradiation to realize temporary lamination and fixation of wafers. Its adhesion decreases significantly after exposure to 365 nm ultraviolet light, enabling residue-free peeling of polyolefin carrier films. It is specially developed for high-cleanliness microelectronic processes such as temporary bonding of semiconductor wafers and peeling after precision coating, and is also applicable to temporary positioning and protection of optical films and precision hardware.

Key Features
1.Controllable tack transition performance: Stable pressure-sensitive adhesion before UV irradiation, firmly hold workpieces to avoid shifting during precision processing; after 365nm UV exposure, the adhesion drops sharply, easy peeling without forceful prying.
2.Zero residue peeling performance: Specially formulated for high-cleanliness semiconductor industry. After debonding, no adhesive residue remains on the wafer surface, no extra cleaning procedure required, effectively improving production efficiency.
3.Uniform ultra-thin coating: Well-adjusted fluidity, support blade coating, roll coating and dispensing. Stable thin coating 10–30μm, no sagging, no glue accumulation, suitable for ultra-thin wafer manufacturing.
4.Low energy UV reaction: Complete de-tack reaction under low UV energy 100mJ/cm², avoid high-energy UV damaging precision substrates such as silicon wafer.
5.Gentle on sensitive substrates: Cured adhesive layer is flexible, will not scratch, crack or deform thin silicon wafers, optical films during peeling.
6.Good chemical stability: No yellowing after curing, resistant to mild humidity and thermal aging, stable performance in cleanroom environment.

Application Fields

1.Semiconductor Industry Temporary bonding & supporting for silicon wafer; temporary fixing during wafer thinning, grinding, dicing process.

2.Optical Materials Industry Temporary lamination & protection for various optical films; auxiliary fixing during precision coating and film cutting.

3.Precision Machining Temporary positioning of precision glass, hardware and thin engineering plastic parts.

4.New Energy & Micro Components Temporary fixture bonding for miniature electronic components during polishing and processing.

Standard Process

1.Substrate Pretreatment: Clean dust, oil and water on substrate surface.

2.Coating: Dispensing / Blade coating / Roll coating, control dry film thickness 10–30μm.

3.Lamination: Attach substrate and polyolefin protective film, apply slight pressure for uniform contact.

4.UV De-Tackifying: Irradiate by 365nm UV light at energy of 100mJ/cm², rest 3–5 minutes at room temperature.

5.Peeling: Strip the protective film evenly; substrate surface keeps clean without residue.

Suitable Substrates:
Silicon Wafer, Polyolefin Film, Optical Glass, PET, PC, Precision Metal, Hard Engineering Plastic