Thermally Conductive Silicone Adhesive

7518 (718-20) is a one-component thermally conductive bonding silicone specially developed for the electronics and electrical industry. It cures at room temperature by reacting with moisture in the air to form a high-performance elastomer with excellent physical and electrical properties. It features high thermal conductivity (2.0±0.2 W/m·K), fast deep curing, a neutral cure system, non-toxicity, non-corrosiveness, excellent adhesion to aluminum alloy, PC, ABS, good vibration resistance, and a UL94V-0 flame retardant rating. It maintains stable physical and mechanical properties from -50℃ to 200℃. It is the best choice for thermal conduction, bonding, fixing, and insulation encapsulation of heat-generating components in power adapters, chargers, switching power supplies, and LED lighting.Shelf life is 12 months.

Product Highlights & Features

One-component, easy to use
 Fast deep curing, high production efficiency
 Neutral cure system, non-toxic and non-corrosive
 Excellent adhesion to aluminum alloy, PC, ABS, etc.
 Elastomer, good vibration resistance
 UL94V-0 flame retardant grade
Stable physical and mechanical properties from -50℃ to 200℃
 High thermal conductivity: 2.0±0.2 W/m·K
 Suitable for power adapters, chargers, switching power supplies, LED lighting, etc.
 Shelf life: 12 months
Packaging: 100ml/tube, 300ml/tube, 2.6L/tube

Operating Instructions

1.Substrate Preparation:
All surfaces must be clean, dry, degreased, and free of contaminants. Suitable cleaning solvents include alcohol-based cleaners, general purpose solvents, etc. For difficult materials like PTFE, PE, PP, and PET, primer treatment is required.

2.Application Method:
Apply the adhesive to the prepared surface and immediately join the other substrate. Complete the operation before a skin forms. Apply appropriate pressure to eliminate trapped air. A bond line thickness of about 0.5mm provides the best bonding effect.

3.Curing Process:

The adhesive cures by reacting with moisture in the air. At 25℃ and 50% RH, the curing depth is 2-4mm in 24 hours. For non-porous materials, the bonding area should not exceed 25mm².

Application Fields & Uses:
Power adapter bonding
 Charger bonding
 Switching power supply bonding
LED lighting bonding
 Heat dissipation
Electronic component fixing
Insulation encapsulation
 Electronic assembly