Thermal Gel

8120 is a one-component thermally conductive gel (thermal gap filler). It features extremely low deformation force, good plasticity, and is capable of covering microscopic uneven surfaces to ensure full contact between mating parts, thereby improving heat transfer efficiency. It offers excellent anti-sagging and anti-cracking performance, good wettability, low contact thermal resistance, certain fluidity for diverse dispensing processes, and low compressive stress. With a thermal conductivity of 1.0 W/m·K, a dielectric strength of ≥12 kV/mm, and UL94 V-0 flame retardant rating, it is suitable for automotive electronics, industrial controllers, mobile communication equipment, tablets, multimedia devices, servers, and PCBA.Shelf life is 12 months, available in 30cc & Customizable  packaging.

Product Highlights & Features

One-component, no mixing required, easy to use
Extremely low deformation force, protects fragile components
 Good plasticity, can cover microscopic uneven surfaces
 Ensures full contact between mating parts, improving heat transfer efficiency
 Excellent anti-sagging and anti-cracking performance
 Good wettability, low contact thermal resistance
Certain fluidity, suitable for various dispensing processes
 Low compressive stress
Thermal conductivity: 1.0 W/m·K
 Dielectric strength: ≥12 kV/mm
 Volume resistivity: 1.0×10¹² Ω·cm
Complies with UL94 V-0 flame retardant rating
 Complies with RoHS/REACH environmental requirements
 Suitable for automotive electronics, industrial controllers, mobile communication equipment, tablets, multimedia devices, desktops, laptops, servers, and PCBA

 Shelf life: 12 months
 Packaging: 30cc & Customizable  packaging.

Operating Instructions

1.Before use, confirm the product condition; no mixing is required, use directly.
2.Clean the surfaces to be coated to ensure they are dry, free of oil, and free of dust.
3.Use dispensing equipment to evenly apply the thermal gel between the heat-generating component and the heat sink.
4.After assembly, the gel fills microscopic uneven surfaces to ensure full contact.
5.After curing/use, proceed with subsequent testing or assembly.

Application Fields & Uses:
Automotive electronics
 Industrial controllers
Mobile communication equipment
 PCB assembly
 Electronic component heat dissipation
 Fragile component cooling
 Thermal management
 Gap filling