UV Curing Glue

This is one-component modified acrylate UV curing gap-filling & sealing adhesive. No reaction occurs without UV exposure. Under 365nm UV light source, it achieves rapid cross-linking curing. Medium-high viscosity delivers anti-sag property for narrow gap filling on electronic parts.

This glue delivers long-term robust bonding. Not designed for post-UV peel-off, different from UV-debonding adhesive series.

Medium-high viscosity, anti-sag, excellent gap-filling performance
Fast cure under 365nm UV light source, fit automated dispensing
Protect solder joints against vibration, moisture and environmental stress
Good adhesion to PC, ABS, PET, copper and metal housing
Solvent-free, RoHS & REACH compliant for consumer-electronics production

Typical Applications

Type-C cable interface gap filling & sealing
Earphone, TWS speaker solder joint reinforcement & protection
Connector, terminal narrow-gap sealing
Small electronic component fixing and encapsulation protection

Component surfaces shall be clean, dry and free of dust, oil and release-agent residue. Clean with industrial-grade surface cleaner and dry fully before dispensing.
Dispense proper amount of glue into target gaps or solder-joint positions. Ensure UV light can directly reach adhesive layer.
Irradiate by 365nm UV light source for full curing. Thicker glue layer needs higher cumulative UV energy. Shadow zones without UV exposure will remain uncured.
Uncured overflow glue can be wiped with volatile industrial cleaning solvent. Cured overflow can only be removed by mechanical method, run small-sample test to avoid damaging electronic parts.