3808DT-1
Taile
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Taile 3808DT-1 is one-part UV-moisture dual-cure acrylate adhesive. Light-exposed area cures fast under UV lamp; shadow zones cure via atmospheric moisture. Good flexibility, bending resistance, low shrinkage, high insulation. Widely used for FPC, TYPE-C, PCB solder joint & battery board reinforcement for mobile, laptop & tablet manufacturing. 30ml / 50ml cartridge available. Free sample support.
Product Overview
3808DT-1 is one-component UV & moisture dual-cure acrylic adhesive. UV light cures exposed sections quickly; shadow areas without UV access will fully cure by ambient moisture.
Designed for reinforcement, protection and bonding of glass, metal and plastics, especially for consumer electronics components including FPC flexible cable, PCB solder points, TYPE-C connectors and battery panels. Cured layer delivers good flexibility, bending resistance, high temperature resistance, strong adhesion, anti-yellowing performance and low shrinkage rate.
Key Features & Advantages
Dual-cure system: UV fast curing + moisture shadow-curing, solves non-illuminated zone curing problem
Excellent adhesion on FPC, PCB solder joints and battery substrates
UV curing performance: 15 seconds cure for 1mm layer at 120mW/cm2 UV intensity
Low shrinkage less than 4%, reduce internal stress for precision electronic parts
Flexible cured film, good bending performance, anti-vibration & weather resistance
High electrical insulation property
100% solid content, solvent-free formula
Item | Specification |
Product Model | 3808DT-1 |
Type | One-Component UV Moisture Dual-Cure Acrylic Structural Adhesive |
Appearance | Pale translucent free-flow liquid |
Solid Content | 100 % |
Viscosity(25℃,5rpm) | 15000-25000mPa·s |
Hardness (Shore D) | 70D |
Shrinkage Rate | less than 4 % |
Elongation at Break | 100 % |
Surface Resistivity | 0.8×10^16Ω |
Volume Resistivity | 1.3×10^16Ω·cm |
Tensile Strength | ≥30MPa |
Shelf Life | 6 months |
Package Size | 30ml cartridge, 50ml cartridge |
Characteristic | UV+Moisture Dual-cure, Low Shrinkage, High Flexibility, Bending Resistance, Anti-yellowing, High Temperature Resistance, Excellent Adhesion, High Insulation, Solvent-free, Fast UV Curing |
Suitable Substrates | Glass, Metal, Engineering Plastic, FPC Flexible Cable, PCB Circuit Board |
Typical Applications
Reinforcement & fixation for FPC flexible cables of mobile phone, tablet, notebook PC
Protection for PCB circuit board solder joints
TYPE-C connector bonding and reinforcement
Battery board fixing & protection
Multi-material bonding for glass, metal, engineering plastic
Curing Conditions
1.UV Curing
Wavelength range: 200-320nm
Test condition: UV intensity set at 120mW/cm2
Cure time(1mm layer): 15 seconds
Required total energy: 1800mJ/cm2
2.Moisture Post-cure for shadow area
After UV irradiation, place parts under 25℃, RH85% environment for 7 days to achieve full moisture curing.
Packaging & Storage
Available Package: 30ml cartridge, 50ml cartridge
Storage Condition: Frozen storage at -18 ~ -25℃, max RH ≤85%. Keep away from sunlight, high-temperature and fire source.
Shelf Life: 6 months under frozen condition. Warm up to room temperature before opening cartridge for use.
Safety Reminder
This adhesive has mild irritation for skin and eyes. Avoid direct skin contact. Rinse skin with soap or alcohol once contacted. In case of eye splash, flush eyes with plenty clean water and seek medical treatment immediately.