Two-Component Condensation Silicone Potting Compound

9210 is a two-component condensation silicone potting compound with a 10:1 mix ratio. It cures at room temperature to form a high-performance elastomer with excellent temperature resistance, waterproof, and electrical insulation properties. With an ultra-low hardness of Shore A 20±5 and a low mixed viscosity of 800±300 cps, it provides extremely low stress on sensitive components and excellent flowability to penetrate precision gaps. The working time is 40-60 minutes, suitable for potting complex structures. It is widely used for potting protection of PCB, LED power supplies, waterproof power supplies, automotive electronic modules, and other precision electronic components.

Two-component condensation silicone potting compound
10:1 mix ratio, easy to use
 Ultra-low hardness: Shore A 20±5, extremely low stress on sensitive components
 Low viscosity: 800±300 cps, good flowability, penetrates precision gaps
 Long working time: 40-60 min, suitable for complex structure precision potting
 Transparent/translucent elastomer, convenient for troubleshooting and rework
Excellent waterproof, temperature resistance, and electrical insulation performance
 Good adhesion to PCB, electronic components, ABS, etc.
Dielectric constant: ≤3.0
 Volume resistivity: ≥1.0×10¹³ Ω·cm
Elongation: ≥100%
 Operating temperature range: -60~200℃
 Produced according to RoHS directive
 Shelf life: 6 months

Packaging: Component A 20kg/barrel, Component B 2kg/barrel 

Operating Instructions

1.Before use, confirm the 10:1 mix ratio of components A and B, and weigh accurately by weight.

2.Clean the potting surfaces to ensure they are dry, free of oil, and free of dust.

3.Add Component B into the container with Component A, and mix thoroughly. Avoid high-speed, long-time mixing to prevent high temperatures.

4.Pour the mixed adhesive into the product to be potted as soon as possible, completing within the 40-60 minute working time.

5.Cure at room temperature; full cure takes 8-24 hours (faster in summer,
slower in winter). Small molecules are released during curing; it is recommended to fully seal after 3 days in summer and 7 days in winter.

Application Fields & Uses

PCB potting
 LED power supply potting
Waterproof power supply potting
Automotive electronic module potting
 Precision electronic module encapsulation
 Circuit board protection
 Moisture-proof protection
Electrical insulation